Abstract: Effects of technological parameters on copper by Ni-P-polytetrafluoroethylene(PTFE) coating were investigated. Experimental results demonstrate that with the increase of surfactant concentration and the decrease of the coating thickness, the PTFE content first ascends and then declines while Ni and P content varies in a small range, and the C content declines. When the pH value increases, the coating grows thicker, the PTFE content ascends while Ni and P content varies in a small scale and the C content varies between 3.47%  and 4.38%. As the PTFE concentration increases, the coating thickness declines, the maximum PTFE content 3.42% appears at the PTFE concentration 13 mL/L while the Ni and P content in the coating decreases, the C content first drops and then increases. Moreover, the coating thickness increases greatly under a higher bath temperature. The maximum value of PTFE content is 7.26% at 85 ℃. The Ni content decreases at a higher temperature and the P content varies between 9.82% and 10.95%. And the C content decreases with the increase of the temperature.

Key words: electroless composite plating; Ni-P-PTFE; technological parameter; coating thickness; composition of the coating