一种计算对流空气条件下MCM器件结温的方法

doi:10.3969/j.issn.1007-7162.2014.04.020

Journal of Guangdong University of Technology ›› 2014, Vol. 31 ›› Issue (4): 104-108.doi: 10.3969/j.issn.1007-7162.2014.04.020

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A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv

Weng Jian-cheng^1,2，He Xiao-qi²，Zhou Bin²，Liu Gang-gang²，Zhao Lei^1,2，En Yun-fei²

1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China; 2. Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou 510610，China

Received:2013-04-12 Online:2014-12-28 Published:2014-12-28

Abstract

Abstract: It investigated the influence of heat exchange between each chip on MCM, and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection, based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%, which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.

Key words: multi-chip module(MCM); junction-ambient thermal resistance matrix; junction temperature; finite-volume method(FEM)；thermal analysis

WENG Jian-Cheng, HE Xiao-Qi, ZHOU Bin, LIU Gang-Gang, ZHAO Lei, EN Yun-Fei. A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv[J].Journal of Guangdong University of Technology, 2014, 31(4): 104-108.