A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv

It investigated the influence of heat exchange between each chip on MCM, and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection, based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%, which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.