广东工业大学学报 ›› 2008, Vol. 25 ›› Issue (4): 24-27.

• 综合研究 • 上一篇    下一篇

半固态成形工艺对Sn-Bi合金性能的影响

  

  1. 广东工业大学材料与能源学院;
  • 出版日期:2008-03-01 发布日期:2008-03-01

The Effect of Semi-Solid Processing Technology on the Performance of Sn-Bi Alloy

  1. Faculty of Material and Energy,Guangdong University of Technology,Guangzhou 510006,China
  • Online:2008-03-01 Published:2008-03-01

摘要: 采用机械搅拌技术制备锡铋合金半固态浆料,研究了搅拌温度、搅拌时间对锡铋半固态合金组织和力学性能的影响.试验结果表明:搅拌速度为320 r/min、搅拌时间为10 min、搅拌温度为145℃时的搅拌效果相对较好,得到了近球形的半固态锡铋合金金相组织,固相颗粒的尺寸较小,分布较均匀.半固态铸造挤压制备温度保险丝的抗拉强度和延伸率与一般普通铸造挤压法相比分别提高了23%和28%;半固态锡铋合金浸润性良好,可以达到温度保险丝的使用要求.

关键词: 锡铋合金; 半固态; 显微组织; 力学性能;

Abstract: Semisolid Sn-Bi alloy slurry can be obtained by mechnical stirring technology.On the basis of the condition tests of stirring speed and shear time,the microstructure and mechanics properties of semi-solid alloy were studied by optical microscopy and universal testing machine.Test results show that the optimal microstructure of semisolid Sn-Bi alloy can be obtained at shear time 10 min with fixed agitating rate 320 r/min,at the temperature of 145 ℃ or so,and the smaller and nearly rounded solid p...

Key words: Sn-Bi alloy; semisolid; microstructure; mechanical property;

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