Abstract: The grinding wheel is a key processing tool in the precision grinding of silicon wafer. The domestic and foreign research on the grinding wheel for wafer precision grinding is summarized and analyzed, proposing that research on wheel preparation technology need further theoretical support. The research on the wheel wear and evaluation method of observation should firstly establish the wheel model, and analyze the wheel wear mechanism of the different grinding stages according to the material properties of silicon wafer, and finally validate wear process by grinding experiments and using the preferred wheel observation and evaluation method.