印刷电路板化学镀铜液回收EDTA的研究

The Recovery of EDTA in Waste PCB Chemical-copper Solution

摘要: 介绍一种印刷电路板化学镀铜废液回收EDTA的方法.利用化学镀铜废液中残留的HCHO,采用在强碱条件下还原除铜,调整废液的pH回收EDTA.该方法Cu的去除率达99.6%,EDTA的回收率大于98%;用回收的EDTA制备EDTA-Na2,纯度大于98.5%.实现化学镀铜废液的回收和循环使用.

Abstract: In this paper copper is reduced by formaldehyde which is contained in the wastewater of chemical copper plating.The EDTA acid can be recycled after acidulation.Using EDTA,EDTA-Na2 and new chemical copper plating solution are prepared.It is shown that the removal rate of copper is 99.6%.The（EDTA） recovery is more than 98%,and the purity of EDTA-Na2 which is made from EDTA is more than 98.5%.It can be used in industrys of chemical copper plating again.