广东工业大学学报 ›› 2014, Vol. 31 ›› Issue (4): 104-108.doi: 10.3969/j.issn.1007-7162.2014.04.020

• 综合研究 • 上一篇    下一篇

一种计算对流空气条件下MCM器件结温的方法

翁建城1,2,何小琦2,周斌2，刘岗岗2，赵磊1,2,恩云飞2   

  1. 1.广东工业大学 材料与能源学院，广东 广州510006；2. 工业和信息化部电子第五研究所 电子元器件可靠性物理及其应用国家重点实验室，广东 广州 510610
  • 收稿日期:2013-04-12 出版日期:2014-12-28 发布日期:2014-12-28
  • 作者简介:翁建城（1987-），男，硕士研究生，主要研究方向为电子元器件可靠性.
  • 基金资助:

    国家重点实验室开放基金资助项目(XF1128330)

A Method to Calculate Junction-Temperature of MCM’s Chips under the Condition of Air Conv

Weng Jian-cheng1,2，He Xiao-qi2，Zhou Bin2，Liu Gang-gang2，Zhao Lei1,2，En Yun-fei2   

  1. 1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China;  2. Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou 510610，China
  • Received:2013-04-12 Online:2014-12-28 Published:2014-12-28

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摘要： 研究多芯片组件（Multi-chip Module，MCM）各元器件之间热传导的相互影响，建立了在对流空气条件下，一种基于结环热阻矩阵的MCM各元器件结温数学计算方法，并利用有限元模拟方法根据不同组合条件对结环热阻矩阵进行验证，结果表明采用结环热阻矩阵预测元器件结温的误差小于6%，说明该方法在某种程度上可运用于对流空气条件下MCM组件的热学分析技术中.

关键词: 多芯片组件;结环热阻矩阵;结温;有限元模拟;热分析

Abstract: It investigated the influence of heat exchange between each chip on MCM, and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection, based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%, which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.

Key words: multi-chip module(MCM); junction-ambient thermal resistance matrix; junction temperature; finite-volume method(FEM)；thermal analysis

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