Journal of Guangdong University of Technology ›› 2002, Vol. 19 ›› Issue (4): 85-89.
• Comprehensive Studies • Previous Articles Next Articles
Study on the Causation of Having No Copper in the Holes of the Printed Circuit Board
- (Faculty of Chemieal Engineering and Light Industry,GDUT,Guangzhou 510090,China)
| [1] 程良. 塑料电镀工艺技术[J]. 电镀与环保. 2001(05) [1] 曾华梁等编.电镀工艺手册[M]. 机械工业出版社, 1997[2] [美]C·R·德雷珀 编,冯昌鑫等 译.印制电路和电子部件的生产[M]. 科学出版社, 1981 |
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Tel：020-37626653,020-37626139,020-37626396
Email：xbzrb@gdut.edu.cn
Supported:Beijing Magtech