Journal of Guangdong University of Technology ›› 2005, Vol. 22 ›› Issue (3): 21-24.

• Comprehensive Studies • Previous Articles     Next Articles

The Recovery of EDTA in Waste PCB Chemical-copper Solution

  

  1. (1.Faculty of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510090,China;2.Shenzhen Hazardous Waste Treatment Station,Shenzhen 518049,China)
  • Online:2005-07-02 Published:2005-07-02

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Abstract: In this paper copper is reduced by formaldehyde which is contained in the wastewater of chemical copper plating.The EDTA acid can be recycled after acidulation.Using EDTA,EDTA-Na2 and new chemical copper plating solution are prepared.It is shown that the removal rate of copper is 99.6%.The（EDTA） recovery is more than 98%,and the purity of EDTA-Na2 which is made from EDTA is more than 98.5%.It can be used in industrys of chemical copper plating again.

Key words: PCB； chemical-copper； EDTA； recovery；

[1] 周永璋,张果金,杨朗.  影响化学镀铜液稳定性和镀 速的因素[J]. 电镀与环保. 1999(05)

[2] 王丽丽.  化学镀铜工艺[J]. 电镀与精饰. 2002(02)

[3] 沈伟.  化学镀铜的沉积过程与镀层性能[J]. 材料保护. 2000(01)

[4] 石萍,李桂云.  对印制板孔金属化直接电镀工艺的评价[J]. 电镀与精饰. 1999(06)

[5] 白拴堂,王玉娉.  化学镀铜新工艺及其在电子工业中的应用[J]. 表面技术. 2000(06)

[1] 黄杉生等编,张正奇主编.分析化学[M]. 科学出版社, 2001

[2] 曾华梁等编.电镀工艺手册[M]. 机械工业出版社, 1997
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