Abstract: Due to the lack of the PCB (Printed Circuit Board) manufacturing experience, it is difficult for designers to consider the problem of signal integrity for high-speed PCB systematically, comprehensively and innovatively. The theory of signal integrity is used to comprehensively analyze the contradictions encountered in the design process, so as to solve the contradictory problems more effectively. Taking the problems encountered in PCB design and fabrication as examples, the method of signal integrity analysis is used to combine the design of copper bridge, differential trace and via holes with the feature of high-speed circuit and manufacturing process, and optimal solution is obtained by the extension innovation of transferring the differential traces from external layer micro-strip to the internal layer strip-line by blind holes. From the examples, it can be found that the signal distortion problem of high-speed PCB can be effectively solved by combining signal integrity analysis and design of manufacturing, and thus the high-speed circuit design and product development cycle is greatly optimized.

Key words: high-speed Printed Circuit Board (PCB), signal integrity, impedance controlled, stripline