Journal of Guangdong University of Technology ›› 2019, Vol. 36 ›› Issue (05): 63-70.doi: 10.12052/gdutxb.180174

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Effects of Aluminum Oxide on Curing and Thermal Decomposition Kinetics of Epoxy Resin

Zhang Ying-ming1, Wang Bing-yi1, Yu Jian1, Hao Zhi-feng1, Ke Yong2, Chen Yi-long2   

  1. 1. School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China;
    2. Kinwong Electronic Technology (Longchuan) Co., Ltd, Heyuan 517300, China
  • Received:2018-12-12 Online:2019-08-21 Published:2019-09-23

Abstract: The effects of high content Al2O3 particles on the apparent activation energy, thermal decomposition kinetics and properties of epoxy resin (E51)/4, 4'-Diaminodiphenylmet (DDM) system were investigated by a thermal analysis. The results on the curing kinetics of non-isothermal differential scanning calorimetry (DSC) showed that the addition of Al2O3 promoted the curing reaction. The activation energy of the E44/DDM system was reduced from 51.49 kJ/mol to 48.12 kJ/mol after 80%Al2O3 addition. In addition, the kinetic parameters of the curing reaction were obtained by the n order model. Thermo-gravimetric analyzer was used to study the thermal decomposition kinetics of the epoxy curing system. The FWO method was used to calculate the activation energy of the degradation. The results showed that the addition of Al2O3 powder had little effect on the initial decomposition activation energy of the 80%E51/DDM system. When the degradation rate reached 30%, the Al2O3 powder had obvious inhibitory effect on the decomposition of E51/DDM system. The results of TG-IR test showed that carbon oxides, methane, carbonyl compounds, amines and aromatic compounds are the main products in the process of E51/DDM thermal decomposition. Al2O3 powder can improve the thermal stability of the E51/DDM system. Dynamic mechanics showed that the addition of Al2O3 increased the modulus of storage of epoxy resin cured products. DSC results showed that the addition of Al2O3 powder increases the glass transition temperature from 114.16℃ to 121.51℃ of the system.

Key words: epoxy resin, Al2O3, curing kinetics, thermal degradation kinetics

CLC Number: 

  • TQ320
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